Principal Engineer, Package Integration and Manufacturability

Описание

NVIDIA is looking for an experienced packaging, technology and manufacturability expert to help build the next generation of networking products, specifically focusing on advanced packaging methods like chiplet integration, 2.5D interposers, and co-packaged optics.

Responsibilities

• Lead the technical assessment of package risk across chip programs, identifying failure modes in substrate, interposer and assembly integration before they reach silicon
• Quantify the cost and schedule impact of identified failure modes and bring them to program and technology reviews with a clear position
• Drive new approaches to manufacturability across package, substrate, interposer, and silicon, spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity
• Push co-design levers such as tolerance relaxation by design, testability before attach, design margins, and redundancy and partial-module recovery
• Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly
• Convert yield findings into concrete design guidance
• Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define product requirements, working closely with the advanced technology group

Requirements

• B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience
• More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly
• Deep understanding of 2.5D, chiplet and organic substrate integration
• Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions drive assembly yield differently from defect density at the die level
• Strong analytic capabilities and passion for solving demanding technical problems
• Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations

Nice to have

• Hands-on experience on an assembly floor, a foundry or at an OSAT
• Experience with co-packaged optics, photonic packaging, or fiber and laser attach
• Proven experience driving design-for-manufacturability into early architecture decisions
• Familiarity with working on large high-end ASICs and multi-die modules

We offer

• Highly competitive salaries and a comprehensive benefits package
• Inclusive, supportive environment where everyone is inspired to do their best work