Senior IC packaging engineer, IC package technologies

Описание

Annapurna Labs, part of Amazon Web Services (AWS), is developing leading edge products, manufactured on leading edge technologies, and offers a dynamic, open, teamwork environment operating at high pace mode.

Responsibilities

• Assume full ownership of mechanical and thermal design of Annapurna ICs
• Engage with product architect and design teams on future products package and assembly needs
• Perform package level thermal simulations
• Perform package level mechanical simulations
• Lead and design thermal and mechanical measurements of ICs
• Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products
• Engage with substrate and assembly vendors on future technologies roadmap
• In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs
• Ensure testability of the ICs in collaboration with Test Engineer team

Requirements

• Experience developing products for volume production
• Experience delivering products to volume production
• Bachelor's degree in Electrical Engineering or a related field
• Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent, or experience applying theoretical models in an applied environment

Nice to have

• Master's degree or Ph.D. degree in Electrical Engineering or related field
• Experience in microelectronics packaging (either wire-bonding or flip chip)

We offer

• Endless knowledge-sharing, mentorship and other career-advancing resources
• Flexible work hours and arrangements